Smart Packaging Hub second online event

CANNED FOOD ROUND TABLE
How to create the Canned Food packaging line of the future for sustainable packaging to the market
27 May, 15:00-16:00 CET time

A packaging line for Canned Food is a complex system, consisting of several machines built by different suppliers, which work together to create a final product.

In this round table, the members of the Smart Packaging Hub will show how their collaboration is promoting innovation and solving the challenges of designing packaging lines for the Canned Food packaging line of the future.

Topics such as predictive maintenance, quality assurance, sustainability and product recyclicality will be discussed with the support of business cases, to provide a comprehensive overview of the latest innovations and opportunities of your future packaging lines.



WHEN?
27 May 2021 15:00-16:00 CET

✔ WHICH TARGET?
Users of packaging machines in the Can Food market.

REASONS TO ATTEND?
• Learn the challenges of designing packaging lines for the Canned Food of the future.
• Know real case history regarding predictive maintenance, quality assurance and sustainability.

SPEAKERS
Moderator
Corné HuijbenManager Knowledge Development & Projects NVC Netherlands Packaging Center

Speakers
George Oostrom, CEO – Coroos
Roberto Campagnini, Sales Manager – Baumer
Luca Carollo, Business Development and Marketing Manager – Clevertech
Marco Cocino, Sales & Marketing – Tosa
Marco Bissoli, Area Sales Manager Key Account – Makro Labelling
Mrs. Waratchara Liangchaikul, After Sales Service Director – Mather & Platt Asia

Related Articles

SCANNY3D: Geometric deformation control on glass bottles

Scanny3D has designed and developed a double laser spot rotating 3D scanner. It is a patented device, 100% “Made in Italy” that performs a 360 ° scan without contact, at high speed, at very high resolution and in a completely automatic way. The 3D scanner allows you to digitize and analyze bottles, plastic bottles, containers

Elite Buyers from the Global Food Processing and Packaging Industry Gather at swop 2024, Focusing on Packaging Technology Innovation and Intelligent Development

In an era of booming demand across the entire packaging industry, Shanghai World of Packaging (swop) has, for many years, brought together the industry’s cutting-edge packaging machinery and equipment, innovative materials, and advanced technology, earning unanimous praise from professional visitors and buyers. Continuing the excitement of previous editions, swop 2024 will be held from November

ELITRON: Introducing Kombo TAV. The future of digital cutting automation

Elitron is raising the bar once more in digital cutting automation with the unveiling of the NEW Kombo TAV at Drupa in Dusseldorf later this month. Looking to take your packaging, sign & display productivity to the next level then don’t miss seeing the very latest innovation from Elitron in Hall 16 on Stand D11.